Research Engineer ─ BEOL Furnaces, (APM), IME

We are looking for a motivated Research & Technical Support Engineer/Scientist to develop, maintain, and support BEOL furnace processes including BEOL metal anneal, barrier/liner engineering, dielectric curing, hydrogen anneals, and stress‑relief treatments. This role involves both fundamental materials science and hands‑on tool/process ownership in a cleanroom research environment. You will collaborate with R&D teams working on advanced interconnect technologies, photonic integration, 3D integration, and novel dielectric/metallization schemes. Job Responsibilities: BEOL Furnace Process Development Develop and optimize BEOL thermal processes including Metal anneal, Barrier/liner stabilization, Dielectric curing, Passivation and Stress‑relief anneals Perform tool qualification, recipe loading, chamber matching, SPC set up and contamination monitoring. Troubleshoot process excursions and ensure stable operations with high repeatability. Correlates anneal conditions with film quality, stress, adhesion, and reliability metrics. Cross‑Functional Collaboration Work closely with teams in Photonic IC, Wide-Bandgap Devices, Packaging and reliability for process integration. Provide guidance for internal projects on thermal budgets, thermal‑stress implications, and BEOL process compatibility for novel materials and device architectures. Job Requirements: Degree (Bachelor, or Master based on job scope) or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields. 3 years of working experience in Semiconductor Fabrication is advantageous. Hands‑on experience with furnace processing, anneals, or BEOL‑related thermal steps is highly wanted. Knowledge of metallization physics, anneal passivation, interconnect reliability and dielectric curing. Understanding of thermal budget constraints and stress‑management in BEOL stacks. Hands-on experience in Design of Experiments (DOE), root cause analysis, and problem-solving methods is desired. Experience in Photonic IC, SiC devices, 2.5D/3D packaging and/or Wafer Bonding would be a plus. Proficiency with materials characterization tools, such as ellipsometry, XRD, XPS, TEM, SEM, stress measurement