Precision Mold Tooling Assembly and Debug Technician

The Precision Mold Tooling Assembly & Debug Technician is responsible for assembling, debugging, and optimizing precision mold tooling in accordance with engineering and design specifications. The role includes performing molding and process optimization to ensure all final products meet customer specifications and quality standards. Key Responsibilities Assemble and debug precision semiconductor mold tooling according to engineering specifications and quality requirements. Perform root-cause analysis and troubleshooting for encapsulation and molding process issues. Conduct tooling adjustments, fine‑tuning, and optimization to achieve required performance and dimensional accuracy. Verify assembly quality using precision measurement tools and ensure adherence to “critical-to-function” dimensions. Collaborate with engineering, production, and QA teams to resolve technical issues and support continuous improvement activities. Maintain proper documentation for assembly steps, test results, and tooling changes. Ensure all work is performed in compliance with safety standards, 5S practices, and company procedures. Job Requirements & Qualifications Technical Expertise Hands‑on tooling skills in precision engineering or experience in plastic injection molding. Strong proficiency in reading and interpreting mechanical drawings and mold assembly schematics. Skilled in precision assembly techniques for mold chase, inserts, and micro components‑. Industry experience in Mold Chase assembly and debug or high precision‑ Plastic Injection Mold assembly. Ability to identify and interpret “critical to‑ ‑function” dimensions in blueprint and drawing reviews. Proficient in using high accuracy‑ measurement equipment such as digital height gauges, micron indicators, and optical comparators. Education: Diploma, NTC, or equivalent technical qualification in Mechanical, Precision Engineering, or related disciplines. Preferred Skills Prior experience in precision tooling assembly, mold tooling, or semiconductor encapsulation processes. Excellent attention to detail and strong problem solving‑ skills. Ability to work independently with minimal supervision as well as collaboratively in a team environment. Good communication skills and a proactive approach to troubleshooting and continuous improvement.