דרושים»הנדסה» Senior/ Staff Package Design Engineer

לפני 18 שעות חברה חסויה Location: Job Type: As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration) Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp Support NPI, qualification, and product sustainment activities, including vendor technical reviewsRequirements: 5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience deg complex packages (BGA, FCBGA, FCCSP) Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designsThis position is open to all candidates. Hide