דרושים»הנדסה» senior package engineer

לפני 22 שעות חברה חסויה Location: Job Type: leading the development of groundbreaking microelectronics packaging for networking business unit's future products collaborating with world-leading vendors to develop highly ambitious packaging solutions thriving in a dynamic and challenging environmentRequirements: what we need to see: bsc or equivalent experience in mechanical engineering / materials engineering / physics or similar 10+ years of experience,at least 5 years of experience with complex asic package development and manufacturing experience co-working with subcontractors and vendors vision and focus for projects and team curious and creative problem solver as well as organized and multi-tasker team oriented, able to move and motivate peers. strong interpersonal skills (verbal and written) high awareness of quality, manufacturability and project schedule ways to stand out of the crowd: hands-on fea mechanical simulation experience team / group / project management - advantage experience with manufacturing environment and manufacturing statistics tools (for example - jmp) background in semiconductor manufacturing processesThis position is open to all candidates. Hide